Highly Stretchable Shape Memory Self-Soldering Conductive Tape with Reversible Adhesion Switched by Temperature

Author:Date:2021-10-28Views:33

论文题目:Highly Stretchable Shape Memory Self-Soldering Conductive Tape with Reversible Adhesion Switched by Temperature

论文作者:Mengyan Wang, Quan Zhang, Yiwen Bo, Chunyang Zhang, Yiwen Lv,
Xiang Fu, Wen He, Xiangqian Fan, Jiajie Liang, Yi Huang, Rujun Ma*, Yongsheng Chen

发表期刊:Nano-Micro Letters, 13(1), 2021

    

Abstract: 

With practical interest in the future applications of next-generation  electronic devices, it is imperative to develop new conductive  interconnecting materials appropriate for modern electronic devices to  replace traditional rigid solder tin and silver paste of high melting  temperature or corrosive solvent requirements. Herein, we design highly  stretchable shape memory self-soldering conductive (SMSC) tape with  reversible adhesion switched by temperature, which is composed of silver  particles encapsulated by shape memory property and anti-fatigue  ability even under the strain of 90%. It also exhibits an initial  conductivity of 2772 S cm(-1) and a maximum tensile strain of similar to  100%. The maximum conductivity could be increased to 5446 S cm(-1) by  decreasing the strain to 17%. Meanwhile, SMSC tape can easily realize a  heating induced reversible strong-to-weak adhesion transition for  self-soldering circuit. The combination of stable conductivity,  excellent shape memory performance, and temperature-switching reversible  adhesion enables SMSC tape to serve two functions of electrode and  solder simultaneously. This provides a new way for conductive  interconnecting materials to meet requirements of modern electronic  devices in the future.